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Showing posts with label computer. Show all posts
Showing posts with label computer. Show all posts

Tuesday, May 8, 2012

New 3U VPX Single Board Computer from GE Improves Throughput While Reducing Thermal Footprint

Press release:

08 May 2012
New 3U VPX Single Board Computer from GE Improves Throughput While Reducing Thermal Footprint
 

  • SBC325 takes advantage of new3rd Generation Intel® Core™ quad core processor technology
  • x16 PCI Express® GPGPU connectivity allows development of High Performance Embedded Computing (HPEC) applications
  • Cost-effective upgrade path for existing users

HUNTSVILLE, AL — May 8, 2012— GE Intelligent Platforms today announced a new rugged single board computer (SBC) based on the latest 3rd Generation Intel® Core™ quad core processor technology. The SBC325 brings substantially increased processing performance to customers using the 3U VPX form factor to develop and deploy demanding industrial and mil/aero applications such as command/control, ISR (intelligence, surveillance, reconnaissance), radar/sonar and signal processing.

3rd Generation Intel Core processors not only offer enhanced performance per watt but can also maintain full performance at more elevated temperatures than the previous generation – offering an opportunity for the development of new capabilities in small form factor applications.

Provision of either a mezzanine XMC/PMC site for optimum flexibility and expandability or a quad fat-pipe (x16 PCI Express®) for highest performance connectivity to GPGPUs makes the SBC325 an exceptionally versatile platform suitable for a wide range of High Performance Embedded Computing (HPEC) applications.

“Many of our customers are working on demanding applications that are highly constrained in terms of size, weight and power – and the 3U VPX SBC325 provides an outstanding solution,” said Rod Rice, General Manager, Military & Aerospace Products, GE Intelligent Platforms. “The improved thermal performance of the new Intel processor helps to deliver improved response times and throughput and reduce the thermal footprint of a solution - or reduce the number of boards required in a system, minimizing its size and weight.”

The new OpenVPX platform – which is 100% compatible with the previous two generations in GE’s 3U VPXcel3 family - makes for a cost-effective, straightforward upgrade path for existing users.

The SBC325 is available in five build levels, from benign (air cooled) to fully rugged (conduction cooled) to provide customers with optimum price/performance.

The SBC325 is offered initially with the 2.1GHz Intel Core i7-3612QE processor featuring Intel Advanced Vector Extensions (Intel AVX), up to 8GBytes of DDR3 memory and a solid state disk drive of up to 32GBytes capacity. These enhanced capabilities are complemented by a broad range of I/O options including Gigabit Ethernet, SATA, USB and audio.

Supported operating systems include Windows® 7, Open Linux®, Wind River Linux and VxWorks®.
About GE
GE (NYSE: GE) works on things that matter. The best people and the best technologies taking on the toughest challenges. Finding solutions in energy, health and home, transportation and finance. Building, powering, moving and curing the world. Not just imagining. Doing. GE works. For more information, visit the company's website at www.ge.com.
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Monday, February 27, 2012

Energy Innovation Summit

Business, Government and Tech Leaders Give the Full Perspective

February 24, 2012 

Secretary of Energy Steven Chu speaking at the 2011 ARPA-E Energy Innovation Summit. | Energy Department file photo. Secretary of Energy Steven Chu speaking at the 2011 ARPA-E Energy Innovation Summit. | Energy Department file photo.

When the third annual ARPA-E Energy Innovation Summit convenes in Washington, DC, next week, key innovators from across the country and around the world will meet to share ideas for solving our greatest energy challenges.

While recent ARPA-E award winners and finalists will be on display at the Technology Showcase, the keynote speakers will offer a personal perspective on innovation in the energy sector.

One of the highlights of the conference will be a "fireside chat" between Bill Gates, chairman of Microsoft Corporation, and Secretary of Energy Steven Chu. Under Gates' leadership, Microsoft has led the computer industry with investments in research and development each year. Check Energy.gov after the Summit for a video of the conversation that you can watch, share, and offer your perspective on.

Former President Bill Clinton will deliver remarks on Wednesday. As the 42nd President of the United States, President Clinton oversaw the longest period of peacetime economic expansion in U.S. history and the creation of more than 22 million jobs. 

We'll also hear from Dr. Arun Majumdar, Director of ARPA-E, and Dr. Susan Hockfield, President of the Massachusetts Institute of Technology (MIT) and co-chair of the President's Advanced Manufacturing Partnership.
From the private sector, we will be joined by Ursula M. Burns, Chairman and CEO of the Xerox Corporation; Frederick W. Smith, Chairman, President and CEO of the FedEx Corporation; and Lee Scott, chairman of BDT Capital and former CEO of Walmart. Each of these individuals has been an innovative leader in their field and will offer their own perspectives on what it takes for innovators and entrepreneurs to succeed in the clean energy economy.

The Summit will also highlight the winning startup companies that competed in DOE’s “America’s Next Top Energy Innovator Challenge," which leverages cutting-edge technologies from the Energy Department’s national laboratories to support new startup companies across the country. The Secretary will present the winners with awards on Monday during the luncheon, and you can learn more about their innovations at their booth in the Technology Showcase.

You can find more information on the ARPA-E Energy Innovation Summit and the full program for the three-day conference here.